OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
MODs vs. NPs: Vying for the Future of Printed Electronics
Samuel P. Douglas, Shreya Mrig, Caroline E. Knapp
Chemistry - A European Journal (2021) Vol. 27, Iss. 31, pp. 8062-8081
Open Access | Times Cited: 37
Samuel P. Douglas, Shreya Mrig, Caroline E. Knapp
Chemistry - A European Journal (2021) Vol. 27, Iss. 31, pp. 8062-8081
Open Access | Times Cited: 37
Showing 1-25 of 37 citing articles:
High‐Resolution 3D Printing for Electronics
Young‐Geun Park, In Sik Yun, Won Gi Chung, et al.
Advanced Science (2022) Vol. 9, Iss. 8
Open Access | Times Cited: 120
Young‐Geun Park, In Sik Yun, Won Gi Chung, et al.
Advanced Science (2022) Vol. 9, Iss. 8
Open Access | Times Cited: 120
Advances in Printing and Electronics: From Engagement to Commitment
P. Martins, Nélson Pereira, Ana Catarina Lima, et al.
Advanced Functional Materials (2023) Vol. 33, Iss. 16
Open Access | Times Cited: 50
P. Martins, Nélson Pereira, Ana Catarina Lima, et al.
Advanced Functional Materials (2023) Vol. 33, Iss. 16
Open Access | Times Cited: 50
Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics
Lijing Wang, Fen Xia, Wangshu Xu, et al.
Advanced Functional Materials (2023) Vol. 33, Iss. 26
Closed Access | Times Cited: 15
Lijing Wang, Fen Xia, Wangshu Xu, et al.
Advanced Functional Materials (2023) Vol. 33, Iss. 26
Closed Access | Times Cited: 15
Interfacial Ultraviolet Cross-Linking of Green Bilayer Dielectrics
Mathieu N. Tousignant, Zheng Lin, Jaclyn L. Brusso, et al.
ACS Applied Materials & Interfaces (2023) Vol. 15, Iss. 2, pp. 3680-3688
Closed Access | Times Cited: 11
Mathieu N. Tousignant, Zheng Lin, Jaclyn L. Brusso, et al.
ACS Applied Materials & Interfaces (2023) Vol. 15, Iss. 2, pp. 3680-3688
Closed Access | Times Cited: 11
High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures
Jianbo Xin, Yue Gao, Chenghao Zhang, et al.
Journal of Materials Processing Technology (2024) Vol. 329, pp. 118435-118435
Closed Access | Times Cited: 4
Jianbo Xin, Yue Gao, Chenghao Zhang, et al.
Journal of Materials Processing Technology (2024) Vol. 329, pp. 118435-118435
Closed Access | Times Cited: 4
In Situ Rheoimpedance and Thermogravimetry–Differential Thermal Analysis of Copper-Based Conductive Inks for High-Oxidation-Resistant Performance
Ryousuke Ishikawa, Yuki Kawata, Hideya Kawasaki
ACS Applied Electronic Materials (2025)
Closed Access
Ryousuke Ishikawa, Yuki Kawata, Hideya Kawasaki
ACS Applied Electronic Materials (2025)
Closed Access
Tailoring ultra-small ZnO nanoparticles through cobalt doping to enhance photocatalytic CO2 reduction
Wenzhu Yang, Imran Ullah, Zhan‐Guo Jiang, et al.
RSC Advances (2025) Vol. 15, Iss. 15, pp. 11934-11941
Open Access
Wenzhu Yang, Imran Ullah, Zhan‐Guo Jiang, et al.
RSC Advances (2025) Vol. 15, Iss. 15, pp. 11934-11941
Open Access
Copper Ion Inks Capable of Screen Printing and Intense Pulsed-Light Sintering on PET Substrates
Soo Min Song, Sungmin Cho
ACS Applied Electronic Materials (2022) Vol. 4, Iss. 4, pp. 1882-1890
Closed Access | Times Cited: 18
Soo Min Song, Sungmin Cho
ACS Applied Electronic Materials (2022) Vol. 4, Iss. 4, pp. 1882-1890
Closed Access | Times Cited: 18
Printing of passive RFID tag antennas on flexible substrates for long read distance applications: Materials and techniques
Mohd Nizar Hamidon, Tark D. Farnana, Intan Helina Hasan, et al.
Journal of Science Advanced Materials and Devices (2024) Vol. 9, Iss. 4, pp. 100778-100778
Open Access | Times Cited: 3
Mohd Nizar Hamidon, Tark D. Farnana, Intan Helina Hasan, et al.
Journal of Science Advanced Materials and Devices (2024) Vol. 9, Iss. 4, pp. 100778-100778
Open Access | Times Cited: 3
Antimicrobial activities and neuroprotective potential for Alzheimer’s disease of pure, Mn, Co, and Al-doped ZnO ultra-small nanoparticles
Imran Ullah, Reinhard B. Neder, Mushtaq Ahmad, et al.
Green Processing and Synthesis (2024) Vol. 13, Iss. 1
Open Access | Times Cited: 3
Imran Ullah, Reinhard B. Neder, Mushtaq Ahmad, et al.
Green Processing and Synthesis (2024) Vol. 13, Iss. 1
Open Access | Times Cited: 3
Molecular copper decomposition ink for printable electronics
Aaron Sheng, Abdullah Islam, Saurabh Khuje, et al.
Chemical Communications (2022) Vol. 58, Iss. 68, pp. 9484-9487
Closed Access | Times Cited: 16
Aaron Sheng, Abdullah Islam, Saurabh Khuje, et al.
Chemical Communications (2022) Vol. 58, Iss. 68, pp. 9484-9487
Closed Access | Times Cited: 16
Conformal Cu–CuNi Thermocouple Using Particle-Free Ink Materials
Aaron Sheng, Saurabh Khuje, Zheng Li, et al.
ACS Applied Electronic Materials (2022) Vol. 4, Iss. 11, pp. 5558-5564
Closed Access | Times Cited: 16
Aaron Sheng, Saurabh Khuje, Zheng Li, et al.
ACS Applied Electronic Materials (2022) Vol. 4, Iss. 11, pp. 5558-5564
Closed Access | Times Cited: 16
Low-Temperature Sintering of Ag Composite Pastes with Different Metal Organic Decomposition Additions
Zixuan Xu, Xun Liu, Junjie Li, et al.
Materials (2023) Vol. 16, Iss. 6, pp. 2340-2340
Open Access | Times Cited: 8
Zixuan Xu, Xun Liu, Junjie Li, et al.
Materials (2023) Vol. 16, Iss. 6, pp. 2340-2340
Open Access | Times Cited: 8
Investigation of Reactive Silver Ink Formula for Reduced Silver Consumption in Silicon Heterojunction Metallization
Steven DiGregorio, Michael Martinez‐Szewczyk, Subbarao Raikar, et al.
ACS Applied Energy Materials (2023) Vol. 6, Iss. 5, pp. 2747-2757
Closed Access | Times Cited: 7
Steven DiGregorio, Michael Martinez‐Szewczyk, Subbarao Raikar, et al.
ACS Applied Energy Materials (2023) Vol. 6, Iss. 5, pp. 2747-2757
Closed Access | Times Cited: 7
Testing the Aquatic Toxicity of 2D Few-Layer Graphene Inks Using Rainbow Trout (Oncorhynchus mykiss): In Vivo and In Vitro Approaches to Support an SSbD Assessment
Gregorio Molés, Mona Connolly, Ana Valdehíta, et al.
Toxics (2024) Vol. 12, Iss. 2, pp. 97-97
Open Access | Times Cited: 2
Gregorio Molés, Mona Connolly, Ana Valdehíta, et al.
Toxics (2024) Vol. 12, Iss. 2, pp. 97-97
Open Access | Times Cited: 2
An Aerosol Jet Printed Resistance Temperature Detector‐Micro Hotplate with Temperature Coefficient of Resistance Stabilized by Electrical Sintering
Yongkun Sui, Lok‐kun Tsui, Alfred J. Thibodeaux, et al.
Advanced Materials Technologies (2023) Vol. 8, Iss. 12
Open Access | Times Cited: 5
Yongkun Sui, Lok‐kun Tsui, Alfred J. Thibodeaux, et al.
Advanced Materials Technologies (2023) Vol. 8, Iss. 12
Open Access | Times Cited: 5
Unraveling the Steric Link to Copper Precursor Decomposition: A Multi‐Faceted Study for the Printing of Flexible Electronics
Shreya Mrig, Malavika A. Bhide, Ye Zhou, et al.
Small Methods (2023) Vol. 7, Iss. 4
Open Access | Times Cited: 4
Shreya Mrig, Malavika A. Bhide, Ye Zhou, et al.
Small Methods (2023) Vol. 7, Iss. 4
Open Access | Times Cited: 4
Importance of the Heat Treatment Scheme on Self-Reducing Reactive Silver Inks
Steven DiGregorio, Subbarao Raikar, Owen Hildreth
ACS Applied Electronic Materials (2023) Vol. 6, Iss. 1, pp. 203-213
Closed Access | Times Cited: 4
Steven DiGregorio, Subbarao Raikar, Owen Hildreth
ACS Applied Electronic Materials (2023) Vol. 6, Iss. 1, pp. 203-213
Closed Access | Times Cited: 4
Advanced Applications of Metal–Organic Decomposition Inks in Printed Electronics
Arnold J. Kell, Kaitlin Wagner, Xiangyang Liu, et al.
ACS Applied Electronic Materials (2023) Vol. 6, Iss. 1, pp. 1-23
Open Access | Times Cited: 4
Arnold J. Kell, Kaitlin Wagner, Xiangyang Liu, et al.
ACS Applied Electronic Materials (2023) Vol. 6, Iss. 1, pp. 1-23
Open Access | Times Cited: 4
Recyclability‐by‐design of Printed Electronics by Low‐Temperature Sintering of Silver Microparticles
David van Impelen, Lola González-Garcı́a, Tobias Kraus
Advanced Electronic Materials (2024)
Open Access | Times Cited: 1
David van Impelen, Lola González-Garcı́a, Tobias Kraus
Advanced Electronic Materials (2024)
Open Access | Times Cited: 1
The effects of complex agent and sintering temperature on conductive copper complex paste
Hamed Naderi-Samani, Reza Shoja Razavi, Reza Mozaffarinia
Heliyon (2022) Vol. 8, Iss. 12, pp. e12624-e12624
Open Access | Times Cited: 6
Hamed Naderi-Samani, Reza Shoja Razavi, Reza Mozaffarinia
Heliyon (2022) Vol. 8, Iss. 12, pp. e12624-e12624
Open Access | Times Cited: 6
Facile Preparation of Monodisperse Cu@Ag Core–Shell Nanoparticles for Conductive Ink in Printing Electronics
Gang Li, Xuecheng Yu, Ruoyu Zhang, et al.
Micromachines (2023) Vol. 14, Iss. 7, pp. 1318-1318
Open Access | Times Cited: 3
Gang Li, Xuecheng Yu, Ruoyu Zhang, et al.
Micromachines (2023) Vol. 14, Iss. 7, pp. 1318-1318
Open Access | Times Cited: 3
Tailored Silver Malonate Conductive Ink with Tunable Performance Formulated from Mixed Silver Dicarboxylates
Wendong Yang, Zhichao Dong, Zihao Guo, et al.
ACS Applied Electronic Materials (2023) Vol. 5, Iss. 5, pp. 2598-2607
Closed Access | Times Cited: 2
Wendong Yang, Zhichao Dong, Zihao Guo, et al.
ACS Applied Electronic Materials (2023) Vol. 5, Iss. 5, pp. 2598-2607
Closed Access | Times Cited: 2
Formulating nickel metal organic decomposition ink with low sintering temperature and high conductivity for ink jet printing applications
Xie Wang, Xiaodong Li, Mu Zhang, et al.
Journal of Materials Science Materials in Electronics (2023) Vol. 34, Iss. 27
Closed Access | Times Cited: 2
Xie Wang, Xiaodong Li, Mu Zhang, et al.
Journal of Materials Science Materials in Electronics (2023) Vol. 34, Iss. 27
Closed Access | Times Cited: 2
