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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Mekala Bharath Krupa Teja, Ashutosh Sharma, Siddhartha Das, et al.
Journal of Materials Science (2022) Vol. 57, Iss. 19, pp. 8597-8633
Closed Access | Times Cited: 41

Showing 1-25 of 41 citing articles:

Recent advances in Sn-based lead-free solder interconnects for microelectronics packaging: Materials and technologies
T.T. Dele‐Afolabi, M.N.M. Ansari, Azmah Hanim Mohamed Ariff, et al.
Journal of Materials Research and Technology (2023) Vol. 25, pp. 4231-4263
Open Access | Times Cited: 42
Innovative Approaches to Tin Recovery from Low-Grade Secondary Resources: A Focus on (Bio)hydrometallurgical and Solvometallurgical Methods
Ewa Rudnik
Materials (2025) Vol. 18, Iss. 4, pp. 819-819
Open Access | Times Cited: 1
The reuse of electronic components from waste printed circuit boards: a critical review
Wenting Zhao, Junqing Xu, Wenlei Fei, et al.
Environmental Science Advances (2022) Vol. 2, Iss. 2, pp. 196-214
Open Access | Times Cited: 23
Study on the effects of Ag addition on the mechanical properties and oxidation resistance of Sn–Zn lead-free solder alloy by high-throughput method
Fang Li, Cunji Pu, Caiju Li, et al.
Journal of Materials Science Materials in Electronics (2023) Vol. 34, Iss. 4
Closed Access | Times Cited: 11
Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock
Zhidai Zhou, Jiahuan Chen, Yu Chen, et al.
Coatings (2023) Vol. 13, Iss. 3, pp. 572-572
Open Access | Times Cited: 11
The effect of indium microalloying on lead-free solders: A review
Bingyi Li, Shiyu Liu, Yuntao Sun, et al.
Materials Science in Semiconductor Processing (2024) Vol. 185, pp. 108956-108956
Closed Access | Times Cited: 4
A Review: Effect of Nanoparticle Additions on the Physical, Microstructural, Interfacial and Mechanical Properties of Low Temperature SnBi Solder Alloys
Amares Singh, Hui Leng Choo, Wei Tan, et al.
JOM (2025)
Closed Access
Microstructure and Mechanical Properties of Sn-Ag-Cu Nanocomposite Solders: A Review
Hisham J. Muhammed, K. Narayan Prabhu
Materials Performance and Characterization (2025) Vol. 14, Iss. 1, pp. 1-25
Closed Access
Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems
Jiwan Kang, Ashutosh Sharma, Jae Pil Jung
Journal of Materials Science Materials in Electronics (2025) Vol. 36, Iss. 12
Closed Access
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding
Guisheng Gan, Hao Yang, Jie Luo, et al.
Microelectronics International (2025)
Closed Access
Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging
Yuanming Chen, Junjie Huang, Yunzhong Huang, et al.
Journal of Materials Science Materials in Electronics (2024) Vol. 35, Iss. 4
Closed Access | Times Cited: 3
Effect of Carbon Nanotubes on the Mechanical, Thermal, and Electrical Properties of Tin-Based Lead-Free Solders: A Review
Liangwei Li, Weiou Qin, Baohua Mai, et al.
Crystals (2023) Vol. 13, Iss. 5, pp. 789-789
Open Access | Times Cited: 7
A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder
Yilin Li, Shuyuan Yu, Liangwei Li, et al.
Metals (2023) Vol. 13, Iss. 7, pp. 1209-1209
Open Access | Times Cited: 7
Machine learning search for stable binary Sn alloys with Na, Ca, Cu, Pd, and Ag
A. Thorn, Daviti Gochitashvili, Saba Kharabadze, et al.
Physical Chemistry Chemical Physics (2023) Vol. 25, Iss. 33, pp. 22415-22436
Open Access | Times Cited: 7
Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for Mini-Light Emitting Diode Packaging
Ashutosh Sharma, Seung Jun Hwang, Jae Pil Jung
ACS Applied Nano Materials (2024) Vol. 7, Iss. 2, pp. 2110-2119
Closed Access | Times Cited: 2
A comprehensive review of radiation effects on solder alloys and solder joints
Norliza Ismail, Wan Yusmawati Wan Yusoff, Nor Azlian Abdul Manaf, et al.
Defence Technology (2024) Vol. 39, pp. 86-102
Open Access | Times Cited: 2
Microstructural Evolution and Phase Transformation on Sn‐Ag Solder Alloys under High‐Temperature Conditions focusing on Ag3Sn phase
Jayesh Shanthi Bhavan, P. Ashwath, Mohamed Amer, et al.
Advanced Engineering Materials (2024) Vol. 26, Iss. 13
Closed Access | Times Cited: 2
A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms
Norliza Ismail, Wan Yusmawati Wan Yusoff, Azuraida Amat, et al.
Defence Technology (2024) Vol. 41, pp. 134-158
Open Access | Times Cited: 2
Counter-intuitive mechanical performance variation in aged low-temperature interconnections in electronic packaging
Wangyun Li, Lanqing Mo, Chen Feng, et al.
Vacuum (2024) Vol. 227, pp. 113367-113367
Closed Access | Times Cited: 2
Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock
Chen Peng, Shanlin Wang, Ming Wu, et al.
Transactions of Nonferrous Metals Society of China (2024) Vol. 34, Iss. 6, pp. 1922-1935
Open Access | Times Cited: 2
Dependence of mechanical and thermal deformation behaviors on crystal size and direction of Cu3Sn intermetallic: A molecular dynamics study
Md. Maruf Billah, Abdur Rahman Aad, Shimanta Das, et al.
Alexandria Engineering Journal (2022) Vol. 66, pp. 79-96
Open Access | Times Cited: 9
In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints
He Gao, Wei Liu, Rong An, et al.
Journal of Materials Research and Technology (2023) Vol. 26, pp. 3506-3523
Open Access | Times Cited: 4
Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging
Ashutosh Sharma, Hyejun Kang, Jae Pil Jung
ACS Applied Nano Materials (2024) Vol. 7, Iss. 2, pp. 1562-1571
Closed Access | Times Cited: 1
Tensile properties dependency on crystal size and direction of single crystal Ag3Sn intermetallic compound: a molecular dynamics study
Md. Maruf Billah, Shimanta Das, Abdur Rahman Aad, et al.
Journal of Materials Research and Technology (2022) Vol. 20, pp. 2094-2108
Open Access | Times Cited: 7
In situ investigation of the formation mechanism of α-Bi2Rh nanoparticles in polyol reductions
Matthias Smuda, Jonas Ströh, Nicole Pienack, et al.
Dalton Transactions (2022) Vol. 51, Iss. 45, pp. 17405-17415
Closed Access | Times Cited: 7
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