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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials
Yung-Sheng Zou, Chong Leong Gan, Min-Hua Chung, et al.
Journal of Materials Science Materials in Electronics (2021) Vol. 32, Iss. 23, pp. 27133-27147
Closed Access | Times Cited: 22

Showing 22 citing articles:

Research Progress on Bonding Wire for Microelectronic Packaging
Hongliang Zhou, Yingchong Zhang, Jun Cao, et al.
Micromachines (2023) Vol. 14, Iss. 2, pp. 432-432
Open Access | Times Cited: 40
Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects
Baohui Xu, Rongmei Chen, Jiuren Zhou, et al.
Micromachines (2022) Vol. 13, Iss. 7, pp. 1148-1148
Open Access | Times Cited: 26
A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms
Norliza Ismail, Wan Yusmawati Wan Yusoff, Azuraida Amat, et al.
Defence Technology (2024) Vol. 41, pp. 134-158
Open Access | Times Cited: 4
PEDOT:PSS/ZnO heterojunctions: resistive switching behavior in memory devices
Rachid Karmouch, Mohammad Shariq, Aysh Y. Madkhli, et al.
Journal of Materials Science Materials in Electronics (2025) Vol. 36, Iss. 2
Closed Access
Reliability and thermal fatigue life prediction of solder joints using nanoindentation
Jie Cao, Xin Lan, Xiao Cui, et al.
Materials Today Communications (2024) Vol. 39, pp. 109240-109240
Closed Access | Times Cited: 3
Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
Chong Leong Gan, Min Hua Chung, Lu-Fu Lin, et al.
Journal of Materials Science Materials in Electronics (2023) Vol. 34, Iss. 30
Closed Access | Times Cited: 7
A Computational Multiscale Modeling Method for Nanosilver-Sintered Joints with Stochastically Distributed Voids
Zhongchao Sun, Wendi Guo, Asger Bjørn Jørgensen
Journal of Electronic Materials (2024) Vol. 53, Iss. 5, pp. 2437-2454
Open Access | Times Cited: 2
Hydrogen as power storage technology, polymeric and interconnect material innovations for future AI datacenter applications: a review
Chong Leong Gan, Min Hua Chung, Chenyu Huang, et al.
Journal of Materials Science Materials in Electronics (2024) Vol. 35, Iss. 30
Closed Access | Times Cited: 1
Effect of electro-thermal diffusion induced deterioration on the failure mechanism of Pd-Au-coated Cu wires
Bo-Ding Wu, Chun‐Hua Hsu, Bo‐Chin Huang, et al.
Journal of Materials Science Materials in Electronics (2024) Vol. 35, Iss. 31
Closed Access | Times Cited: 1
Technological sustainable materials and enabling in semiconductor memory industry: A review
Chong Leong Gan, Min-Hua Chung, Yung-Sheng Zou, et al.
e-Prime - Advances in Electrical Engineering Electronics and Energy (2023) Vol. 5, pp. 100245-100245
Open Access | Times Cited: 3
Effects of different inhibitor on antioxidation of copper bonding wire at room temperature
Xiaokang He, Libin Guo, Gong Gaosen, et al.
Journal of Materials Science Materials in Electronics (2022) Vol. 33, Iss. 13, pp. 10561-10571
Closed Access | Times Cited: 5
A review on future novel interconnect and polymeric materials for cryogenic memory packaging
Chong Leong Gan, Chen-Yu Huang, Yung-Sheng Zou, et al.
Journal of Materials Science Materials in Electronics (2023) Vol. 34, Iss. 29
Closed Access | Times Cited: 2
Reliability and Thermal Fatigue Life Prediction of Solder Joints Using Nanoindentation
Jie Cao, Xin Lan, Xiao Cui, et al.
(2023)
Closed Access | Times Cited: 2
Wearout Reliability-Based Characterization in Memory Packaging
Gan Chong Leong, Huang Chen-Yu
Springer series in reliability engineering (2023), pp. 21-44
Closed Access | Times Cited: 1
Recycling of Noble Metals Used in Memory Packaging
Gan Chong Leong, Huang Chen-Yu
Springer series in reliability engineering (2023), pp. 45-66
Closed Access | Times Cited: 1
Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package
Ahmad Zarif Azahar, Maria Abu Bakar, Azman Jalar, et al.
Journal of Materials Engineering and Performance (2023) Vol. 33, Iss. 12, pp. 5836-5845
Closed Access | Times Cited: 1
A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface
Junling Fan, Donglin Yuan, Juan Du, et al.
Materials (2024) Vol. 17, Iss. 17, pp. 4335-4335
Open Access
Effects of Palladium Content on the Properties and High-Humidity Reliability of Silver Alloy Wires
Sang-Yeob Kim, Sung-Min Jeon, Hyunjun Park, et al.
Korean Journal of Metals and Materials (2024) Vol. 62, Iss. 9, pp. 705-712
Open Access
Forming Mechanism of Cu@Ag Composite Preforms by Electromagnetic Compaction for Power Electronics
Li Liu, Qian Wang, Chunhua Zhang, et al.
(2024), pp. 1-6
Closed Access
Chip fabrication from electrochemical perspective: challenges and opportunities
Harshita Rai, Arunadevi Natarajan, Shilpi Birla, et al.
Electrochemistry (2024), pp. 441-475
Closed Access
Fast fabrication of high thermal conductivity copper-diamond composites via DC electrodeposition with simple electrolyte formula
Pengfei Su, Yang Peng, Zhirui Xu, et al.
Journal of the Taiwan Institute of Chemical Engineers (2024) Vol. 167, pp. 105825-105825
Closed Access
Temperature Driven Current–Voltage Characteristics of Ionic Liquid Type Intelligent Connection Device
Masakazu Kobayashi, Yasumitsu Orii, Hisashi Shima, et al.
IEEE Journal of the Electron Devices Society (2022) Vol. 10, pp. 893-897
Open Access
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