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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Evolution and investigation of copper and gold ball bonds in extended reliability stressing
Chong Leong Gan, Classe Francis, Bak Lee Chan, et al.
Gold bulletin (2014) Vol. 47, Iss. 3, pp. 141-151
Open Access | Times Cited: 25

Showing 25 citing articles:

Inversion for Thermal Properties with Frequency Domain Thermoreflectance
Benjamin Treweek, Volkan Akçelik, Wyatt Hodges, et al.
ACS Applied Materials & Interfaces (2024) Vol. 16, Iss. 3, pp. 4117-4125
Open Access | Times Cited: 7
Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire
Qi Li, Yangbo Li, Haodong Fu, et al.
IEEE Transactions on Components Packaging and Manufacturing Technology (2023) Vol. 13, Iss. 7, pp. 1045-1057
Closed Access | Times Cited: 14
Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years
Chong Leong Gan, U. Hashim
Journal of Materials Science Materials in Electronics (2015) Vol. 26, Iss. 7, pp. 4412-4424
Closed Access | Times Cited: 48
Copper Wire Bonding: A Review
Hongliang Zhou, Andong Chang, Junling Fan, et al.
Micromachines (2023) Vol. 14, Iss. 8, pp. 1612-1612
Open Access | Times Cited: 13
A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials
Yung-Sheng Zou, Chong Leong Gan, Min-Hua Chung, et al.
Journal of Materials Science Materials in Electronics (2021) Vol. 32, Iss. 23, pp. 27133-27147
Closed Access | Times Cited: 22
Superior performance and reliability of copper wire ball bonding in laminate substrate based ball grid array
Chong Leong Gan, F. C. Classe, U. Hashim
Microelectronics International (2013) Vol. 30, Iss. 3, pp. 169-175
Closed Access | Times Cited: 16
3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion
Pradeep Lall, Yunli Zhang, Jeff Suhling, et al.
(2019)
Closed Access | Times Cited: 14
Multiphysics-modeling of corrosion in copper-aluminum interconnects in high humidity environments
Pradeep Lall, Yihua Luo, Luu Nguyen
(2015), pp. 1045-1056
Closed Access | Times Cited: 13
Life prediction of copper wire bonds in commercial devices using principal component analysis (PCA)
Subramani Manoharan, Chandradip Patel, S. Dunford, et al.
Microelectronics Reliability (2019) Vol. 99, pp. 137-151
Closed Access | Times Cited: 8
Advanced Memory and Device Packaging
Gan Chong Leong, Huang Chen-Yu
Springer series in reliability engineering (2023), pp. 1-19
Closed Access | Times Cited: 2
A Review of Silver Wire Bonding Techniques
Bin An, Hongliang Zhou, Jun Cao, et al.
Micromachines (2023) Vol. 14, Iss. 11, pp. 2129-2129
Open Access | Times Cited: 2
Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination
Lois Liao, Xi Zhang, Xiaomin Li, et al.
(2019), pp. 1-6
Closed Access | Times Cited: 5
Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contaminations
Liao Jinzhi Lois, Bisheng Wang, Zheng Haipeng, et al.
(2019), pp. 197-202
Closed Access | Times Cited: 5
Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability, and Manufacturability of Gold Wedge Bonds
Muhammad Nubli Zulkifli, Azman Jalar, Fuaida Harun
IEEE Transactions on Components Packaging and Manufacturing Technology (2019) Vol. 9, Iss. 4, pp. 763-769
Closed Access | Times Cited: 4
Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)
Mohammad Zainudeen Moideen, Chong Leong Gan
(2016), pp. 1-4
Closed Access | Times Cited: 2
bHAST, PCT, TCT reliability performance comparison of Cu-Al, PdCu-Al, Ag-Al
Liao Jinzhi Lois, Tee Weikok, Yu Minglang, et al.
(2020), pp. 63-67
Closed Access | Times Cited: 3
Experimental Verification for Numerical Simulation of Thalamic Stimulation-Evoked Calcium-Sensitive Fluorescence and Electrophysiology with Self-Assembled Multifunctional Optrode
Yao-Wen Liang, Ming-Liang Lai, Feng‐Mao Chiu, et al.
Biosensors (2023) Vol. 13, Iss. 2, pp. 265-265
Open Access | Times Cited: 1
Wearout Reliability-Based Characterization in Memory Packaging
Gan Chong Leong, Huang Chen-Yu
Springer series in reliability engineering (2023), pp. 21-44
Closed Access | Times Cited: 1
Recycling of Noble Metals Used in Memory Packaging
Gan Chong Leong, Huang Chen-Yu
Springer series in reliability engineering (2023), pp. 45-66
Closed Access | Times Cited: 1
A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface
Junling Fan, Donglin Yuan, Juan Du, et al.
Materials (2024) Vol. 17, Iss. 17, pp. 4335-4335
Open Access
Comparison of Cl effect on Au-Al and Cu-Al HTS and bHAST wire bond reliability performance
Bisheng Wang, Lois Liao Jinzhi, Xi Zhang, et al.
(2019), pp. 1-6
Closed Access | Times Cited: 2
Solder joint reliability enhancement through surface mounting solder joint reflow optimization in enterprise grade solid state drives (SSDs)
Mohammad Zainudeen Moideen, Chong Leong Gan
(2016)
Closed Access | Times Cited: 1
Reliability lifetime predictions on long term biased humidity reliability of Cu ball bonds
Chong Leong Gan, U. Hashim
(2015)
Closed Access
Thin copper wire under extreme HTSL stress duration: Crack failure mechanism characterization
R. Enrici Vaion, A. Mancaleoni, L. Cola, et al.
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2016), pp. 468-471
Closed Access
Corrosion Kinetics Investigation on Cu-Al Alloy in Sulfate Environment under Various Temperature and pH Values
Pradeep Lall, Yunli Zhang, Sung-Mo Jung
(2023), pp. 1-7
Closed Access
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