OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Completely aqueous route for metallization of structural polymeric materials in micro-electro-mechanical systems
Xuan Tuan Le, Jean-Sébastien Poirier, Sébastien Michel
Applied Surface Science (2019) Vol. 478, pp. 717-724
Closed Access | Times Cited: 13
Xuan Tuan Le, Jean-Sébastien Poirier, Sébastien Michel
Applied Surface Science (2019) Vol. 478, pp. 717-724
Closed Access | Times Cited: 13
Showing 13 citing articles:
3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review
Jiratti Tengsuthiwat, Sanjay Mavinkere Rangappa, Suchart Siengchin, et al.
Polymers (2020) Vol. 12, Iss. 6, pp. 1408-1408
Open Access | Times Cited: 25
Jiratti Tengsuthiwat, Sanjay Mavinkere Rangappa, Suchart Siengchin, et al.
Polymers (2020) Vol. 12, Iss. 6, pp. 1408-1408
Open Access | Times Cited: 25
Covalently formation of insulation and barrier layers in high aspect ratio TSVs
Yaofang Hu, Lishuang Xiong, Ming Li, et al.
Applied Surface Science (2021) Vol. 573, pp. 151588-151588
Closed Access | Times Cited: 10
Yaofang Hu, Lishuang Xiong, Ming Li, et al.
Applied Surface Science (2021) Vol. 573, pp. 151588-151588
Closed Access | Times Cited: 10
Ni3S2/bamboo fiber film flexible electrodes based on P self-doped interfacially coupled conductive networks
Yiqing Shi, Xianchun Yu, Rongxiang Zeng, et al.
Journal of Alloys and Compounds (2024), pp. 176705-176705
Closed Access | Times Cited: 1
Yiqing Shi, Xianchun Yu, Rongxiang Zeng, et al.
Journal of Alloys and Compounds (2024), pp. 176705-176705
Closed Access | Times Cited: 1
Polyimide Metallization Using Nickel Nano-Film as both Catalyst and Barrier Layer of Copper Electroless Deposition
Shang-En Huang, Fangyu Shen, Wei‐Ping Dow
Journal of The Electrochemical Society (2019) Vol. 166, Iss. 15, pp. D843-D850
Closed Access | Times Cited: 9
Shang-En Huang, Fangyu Shen, Wei‐Ping Dow
Journal of The Electrochemical Society (2019) Vol. 166, Iss. 15, pp. D843-D850
Closed Access | Times Cited: 9
The possibility of the polyurethane layer attachment to the unmodified and diazonium-modified titanium alloy applied as potential biomaterial
Mariusz Sandomierski, Tomasz Buchwald, Adam Voelkel
Surface and Coatings Technology (2020) Vol. 385, pp. 125389-125389
Closed Access | Times Cited: 9
Mariusz Sandomierski, Tomasz Buchwald, Adam Voelkel
Surface and Coatings Technology (2020) Vol. 385, pp. 125389-125389
Closed Access | Times Cited: 9
Direct Electroless Deposition of Nickel onto Silicon Nitride Ceramic: A Novel Approach for Copper Metallization of Micro‐/Nano‐fabricated Devices
Gul Zeb, Thi Luong Duong, Marek Balazinski, et al.
Advanced Engineering Materials (2020) Vol. 23, Iss. 2
Closed Access | Times Cited: 7
Gul Zeb, Thi Luong Duong, Marek Balazinski, et al.
Advanced Engineering Materials (2020) Vol. 23, Iss. 2
Closed Access | Times Cited: 7
Advances in Pretreatments for Electroless Copper Plating on Polymer Materials
Anni Zheng, Lei Jin, Jiaqiang Yang, et al.
Acta Chimica Sinica (2022) Vol. 80, Iss. 5, pp. 659-659
Open Access | Times Cited: 5
Anni Zheng, Lei Jin, Jiaqiang Yang, et al.
Acta Chimica Sinica (2022) Vol. 80, Iss. 5, pp. 659-659
Open Access | Times Cited: 5
Electroless Metallization of the Elements: Survey and Progress
Claudia Turró, Walter J. Dressick
ACS Applied Electronic Materials (2022) Vol. 4, Iss. 12, pp. 5664-5732
Closed Access | Times Cited: 4
Claudia Turró, Walter J. Dressick
ACS Applied Electronic Materials (2022) Vol. 4, Iss. 12, pp. 5664-5732
Closed Access | Times Cited: 4
Chemical metallization of ultrathin polymer insulation film for through-silicon via application
Yaofang Hu, Lishuang Xiong, Tao Hang, et al.
Thin Solid Films (2021) Vol. 734, pp. 138842-138842
Closed Access | Times Cited: 4
Yaofang Hu, Lishuang Xiong, Tao Hang, et al.
Thin Solid Films (2021) Vol. 734, pp. 138842-138842
Closed Access | Times Cited: 4
Autocatalytic Deposition of Nickel–Boron Diffusion Barrier onto Diazonium-Treated SiO2 for High Aspect Ratio Through-Silicon Via Technology in 3D Integration
Gul Zeb, Nguyen Tien Dat, Thi Phuong Ly Giang, et al.
ACS Applied Electronic Materials (2024) Vol. 6, Iss. 3, pp. 2011-2018
Closed Access
Gul Zeb, Nguyen Tien Dat, Thi Phuong Ly Giang, et al.
ACS Applied Electronic Materials (2024) Vol. 6, Iss. 3, pp. 2011-2018
Closed Access
Electrochemical Grafting of an Aminated Poly(methyl methacrylate) (PMMA)-like Liner onto a Silicon Surface for the Metallization of Microfeatures
Gul Zeb, Xuan Tuan Le
ACS Applied Engineering Materials (2022) Vol. 1, Iss. 1, pp. 13-22
Open Access | Times Cited: 1
Gul Zeb, Xuan Tuan Le
ACS Applied Engineering Materials (2022) Vol. 1, Iss. 1, pp. 13-22
Open Access | Times Cited: 1
Chemical Metallization of Insulating Polymeric Surfaces Through Simple Diazonium-Based Covalent Amination
Viet Anh Ly, Vu Ngoc Pi, Duy Cuong Nguyen, et al.
Lecture notes in networks and systems (2018), pp. 188-195
Closed Access
Viet Anh Ly, Vu Ngoc Pi, Duy Cuong Nguyen, et al.
Lecture notes in networks and systems (2018), pp. 188-195
Closed Access
A Study on Electroless Copper Plating on Poly (Methyl Methacrylate) Through Organic Covalent Grafting
Ly Viet Anh, Vu Ngoc Pi
Lecture notes in networks and systems (2019), pp. 94-99
Closed Access
Ly Viet Anh, Vu Ngoc Pi
Lecture notes in networks and systems (2019), pp. 94-99
Closed Access
