OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Research progress on the application of ceria nanoparticles as abrasives in dielectric layer CMP and post cleaning: Structure, morphology, doping, and mechanism
Xinyu Han, Renhao Liu, Baimei Tan, et al.
Colloids and Surfaces A Physicochemical and Engineering Aspects (2023) Vol. 679, pp. 132551-132551
Closed Access | Times Cited: 13
Xinyu Han, Renhao Liu, Baimei Tan, et al.
Colloids and Surfaces A Physicochemical and Engineering Aspects (2023) Vol. 679, pp. 132551-132551
Closed Access | Times Cited: 13
Showing 13 citing articles:
Trivalent lanthanum and ytterbium doped meso-silica/ceria abrasive systems toward chemical mechanical polishing (CMP) and ultraviolet irradiation-assisted photochemical mechanical polishing (PCMP)
Zihan Kou, Chao Wang, Wenjin Zhou, et al.
Applied Surface Science (2024) Vol. 657, pp. 159733-159733
Closed Access | Times Cited: 14
Zihan Kou, Chao Wang, Wenjin Zhou, et al.
Applied Surface Science (2024) Vol. 657, pp. 159733-159733
Closed Access | Times Cited: 14
Controlled Synthesis of Triangular Submicron-Sized CeO2 and Its Polishing Performance
Xingzi Wang, Ning Wang, Zhenyu Zhang, et al.
Materials (2024) Vol. 17, Iss. 9, pp. 2001-2001
Open Access | Times Cited: 5
Xingzi Wang, Ning Wang, Zhenyu Zhang, et al.
Materials (2024) Vol. 17, Iss. 9, pp. 2001-2001
Open Access | Times Cited: 5
Magnetic particle dispersion in magnetorheological slurries for planarization enhancement
An-Jun Zheng, Chia‐Chen Li
Journal of Magnetism and Magnetic Materials (2025), pp. 172803-172803
Closed Access
An-Jun Zheng, Chia‐Chen Li
Journal of Magnetism and Magnetic Materials (2025), pp. 172803-172803
Closed Access
Preparation of CeO2 Polishing Powder and Its Performance and Mechanism for Chemical Mechanical Polishing of Optical Glass
Wei Zhang, Peiwei Zhang, Wu Yuan, et al.
ACS Applied Materials & Interfaces (2025)
Closed Access
Wei Zhang, Peiwei Zhang, Wu Yuan, et al.
ACS Applied Materials & Interfaces (2025)
Closed Access
The effect of amino acid addition in CeO2-based slurry on SiO2/Si3N4 CMP: Removal rate selectivity, morphology, and mechanism research
Xinyu Han, Shihao Zhang, Renhao Liu, et al.
Journal of Molecular Liquids (2024) Vol. 412, pp. 125855-125855
Closed Access | Times Cited: 2
Xinyu Han, Shihao Zhang, Renhao Liu, et al.
Journal of Molecular Liquids (2024) Vol. 412, pp. 125855-125855
Closed Access | Times Cited: 2
Enhanced chemical mechanical polishing (CMP) performance of porous self-assembled spherical cerium oxide via RE(La/Pr/Nd) doping
Zhenyu Zhang, Ning Wang, Xingzi Wang, et al.
Applied Surface Science (2024), pp. 161236-161236
Closed Access | Times Cited: 2
Zhenyu Zhang, Ning Wang, Xingzi Wang, et al.
Applied Surface Science (2024), pp. 161236-161236
Closed Access | Times Cited: 2
Nanocasting synthesis of mesoporous CeO2 particle abrasives from mesoporous SiO2 hard templates for enhanced chemical mechanical polishing performance
Yang Chen, Yifan Xia, Chao Wang, et al.
Ceramics International (2024)
Closed Access | Times Cited: 2
Yang Chen, Yifan Xia, Chao Wang, et al.
Ceramics International (2024)
Closed Access | Times Cited: 2
Investigation of Polisher Head and Slurry Sweep Effect in Oxide Film Polishing
Pengzhan Liu, Chul Kang, Kihong Park, et al.
ECS Journal of Solid State Science and Technology (2024) Vol. 13, Iss. 4, pp. 044004-044004
Open Access | Times Cited: 1
Pengzhan Liu, Chul Kang, Kihong Park, et al.
ECS Journal of Solid State Science and Technology (2024) Vol. 13, Iss. 4, pp. 044004-044004
Open Access | Times Cited: 1
Study on uniform size and spherical CeO2 abrasives synthesized by two-step method and their chemical mechanical polishing performances
Ning Xu, Yu Lin, Yuxin Luo, et al.
Materials Science in Semiconductor Processing (2024) Vol. 185, pp. 108920-108920
Closed Access
Ning Xu, Yu Lin, Yuxin Luo, et al.
Materials Science in Semiconductor Processing (2024) Vol. 185, pp. 108920-108920
Closed Access
Novel CeO2@MOF and its derived abrasives for rapid chemical mechanical polishing
Shaoping Li, Kai Feng, Huidong Cui, et al.
Materials Science in Semiconductor Processing (2024) Vol. 188, pp. 109182-109182
Closed Access
Shaoping Li, Kai Feng, Huidong Cui, et al.
Materials Science in Semiconductor Processing (2024) Vol. 188, pp. 109182-109182
Closed Access
Synthesis, characterization and CMP property of neat and doped mesoporous ceria as defective active particle abrasives
Yang Chen, Pingyang Li, Chao Wang, et al.
Surfaces and Interfaces (2024) Vol. 56, pp. 105614-105614
Closed Access
Yang Chen, Pingyang Li, Chao Wang, et al.
Surfaces and Interfaces (2024) Vol. 56, pp. 105614-105614
Closed Access
Generation of Charges During the Synthesis of Nanopowders of Doped Cerium Dioxide in Combustion Reactions
А. А. Остроушко, О. В. Русских, T. Yu. Zhulanova, et al.
Materials (2024) Vol. 17, Iss. 24, pp. 6066-6066
Open Access
А. А. Остроушко, О. В. Русских, T. Yu. Zhulanova, et al.
Materials (2024) Vol. 17, Iss. 24, pp. 6066-6066
Open Access
The Stability Evaluation of Ceria Slurry Using Polymer Dispersants with Varying Contents for Chemical Mechanical Polishing Process
Sohee Hwang, Jihee Park, Woonjung Kim
Polymers (2024) Vol. 16, Iss. 24, pp. 3593-3593
Open Access
Sohee Hwang, Jihee Park, Woonjung Kim
Polymers (2024) Vol. 16, Iss. 24, pp. 3593-3593
Open Access
