OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Atomic scale investigation of notch evolution on 4H-SiC under different cutting surfaces and environments
Yuqi Zhou, Yuhua Huang, Jinming Li, et al.
Journal of Manufacturing Processes (2023) Vol. 105, pp. 99-111
Closed Access | Times Cited: 9

Showing 9 citing articles:

Micromechanical properties characterization of 4H–SiC single crystal by indentation and scratch methods
Dongyang Hou, Ting Lv, Yuhang Ouyang, et al.
Materials Science in Semiconductor Processing (2024) Vol. 180, pp. 108543-108543
Closed Access | Times Cited: 5

Dependence of deformation and damage behaviors on nano scratch defects of monocrystalline 3C-SiC in fixed abrasive processes
Piao Zhou, Xue Li, Chi Fai Cheung, et al.
Surfaces and Interfaces (2025) Vol. 59, pp. 105931-105931
Closed Access

Atomistic simulations of the thinning process of tantalum/copper heterostructure in wafer containing through silicon via
Kezhong Xu, Yuqi Zhou, Yu Ziniu, et al.
Applied Surface Science (2024) Vol. 676, pp. 161026-161026
Closed Access | Times Cited: 2

Investigation on the Surface Damage Mechanism of Single-Crystal γ-TiAl Alloy with Pore Defects Based on Nanocutting
Ping Zhang, Hanping Zhou, Yajie Sun, et al.
Vacuum (2024) Vol. 229, pp. 113613-113613
Closed Access | Times Cited: 2

Study on the mechanism of glass-SiC-glass anodic bonding process
Xiao Cheng, Lifang Hu, Wei Liu, et al.
Journal of Micromechanics and Microengineering (2024) Vol. 34, Iss. 4, pp. 045010-045010
Closed Access | Times Cited: 2

Investigation of the elastic-plastic evolution mechanism of 4H-SiC substrates with external thermal-assisted abrasion
Piao Zhou, Chi Fai Cheung
Materials Science in Semiconductor Processing (2024) Vol. 185, pp. 108991-108991
Closed Access

Optimizing machinability and minimizing dislocation slip in hexagonal silicon carbide: The role of off-axis angle and processing surface type
Jianwei Ji, Cheng Fan, Binbin Meng
Journal of Manufacturing Processes (2024) Vol. 132, pp. 93-104
Closed Access

SiC Wafer Chamfering Process Research
Xiaocheng Jiang, Xiufei Hu, Wancheng Yu, et al.
(2024), pp. 1-5
Closed Access

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