OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study
Balázs Illés, Halim Choi, Krzysztof Szostak, et al.
Journal of Materials Research and Technology (2024) Vol. 32, pp. 609-620
Open Access | Times Cited: 6
Balázs Illés, Halim Choi, Krzysztof Szostak, et al.
Journal of Materials Research and Technology (2024) Vol. 32, pp. 609-620
Open Access | Times Cited: 6
Showing 6 citing articles:
Effect of doping Si3N4 nanoparticles on the properties and microstructure of Sn1.0Ag0.5Cu solder
Mo Chen, Liang Zhang, Yuhao Chen, et al.
Materials Today Communications (2025), pp. 111728-111728
Closed Access
Mo Chen, Liang Zhang, Yuhao Chen, et al.
Materials Today Communications (2025), pp. 111728-111728
Closed Access
Microstructure and Mechanical Properties of Sn-Ag-Cu Nanocomposite Solders: A Review
Hisham J. Muhammed, K. Narayan Prabhu
Materials Performance and Characterization (2025) Vol. 14, Iss. 1, pp. 1-25
Closed Access
Hisham J. Muhammed, K. Narayan Prabhu
Materials Performance and Characterization (2025) Vol. 14, Iss. 1, pp. 1-25
Closed Access
Study on the electrochemical corrosion behavior and solderability of SnAgCuNi solder alloy
Ziheng Zhao, Xuan Liu, Luntao Wang, et al.
Journal of Materials Research and Technology (2025)
Open Access
Ziheng Zhao, Xuan Liu, Luntao Wang, et al.
Journal of Materials Research and Technology (2025)
Open Access
High corrosion resistance and tensile strength in SAC305/Cu solder joint via super-rapid cooling
Jiyou Yang, Hao Ren, Linmei Yang, et al.
Journal of Materials Science Materials in Electronics (2025) Vol. 36, Iss. 12
Closed Access
Jiyou Yang, Hao Ren, Linmei Yang, et al.
Journal of Materials Science Materials in Electronics (2025) Vol. 36, Iss. 12
Closed Access
Integrated ceramic membrane coupling with CuO@ATT/AC for peroxymonosulfate activation to remove sulfadiazine in water
Songxue Wang, Jingjing Xia, Yiding Wang, et al.
Separation and Purification Technology (2024) Vol. 356, pp. 130020-130020
Closed Access | Times Cited: 1
Songxue Wang, Jingjing Xia, Yiding Wang, et al.
Separation and Purification Technology (2024) Vol. 356, pp. 130020-130020
Closed Access | Times Cited: 1
Nanoparticle-reinforced solder alloys: A comprehensive review of recent formulation properties, and mechanical performance
Muhamad Zamri Yahaya, Ezzatul Farhain Azmi, Nor Azmira Salleh, et al.
Journal of Materials Research and Technology (2024) Vol. 32, pp. 3682-3707
Open Access
Muhamad Zamri Yahaya, Ezzatul Farhain Azmi, Nor Azmira Salleh, et al.
Journal of Materials Research and Technology (2024) Vol. 32, pp. 3682-3707
Open Access
