OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint
Zhihang Zhang, Jiawei Qu, Tao Ma, et al.
Materials Characterization (2024) Vol. 210, pp. 113832-113832
Closed Access | Times Cited: 7
Zhihang Zhang, Jiawei Qu, Tao Ma, et al.
Materials Characterization (2024) Vol. 210, pp. 113832-113832
Closed Access | Times Cited: 7
Showing 7 citing articles:
Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations
Tao Ma, Shiqiang Zhang, Zhihang Zhang, et al.
Materials Characterization (2024) Vol. 215, pp. 114193-114193
Closed Access | Times Cited: 4
Tao Ma, Shiqiang Zhang, Zhihang Zhang, et al.
Materials Characterization (2024) Vol. 215, pp. 114193-114193
Closed Access | Times Cited: 4
Effect of casting moulds on grain morphology, mechanical and tribological properties of Sn–Cu alloy
J M Channaveera Swamy, Veerabhadrappa Algur, Satyanarayan, et al.
Bulletin of Materials Science (2025) Vol. 48, Iss. 2
Closed Access
J M Channaveera Swamy, Veerabhadrappa Algur, Satyanarayan, et al.
Bulletin of Materials Science (2025) Vol. 48, Iss. 2
Closed Access
Microstructure evolution and mechanical properties of Ti2AlNb-C/C joints brazed with Ag-Cu filler
Jingxin Xu, Wenlong Zhou, Xiaoguo Song, et al.
Materials Today Communications (2025), pp. 111827-111827
Closed Access
Jingxin Xu, Wenlong Zhou, Xiaoguo Song, et al.
Materials Today Communications (2025), pp. 111827-111827
Closed Access
Influence and mechanism of Pt micro-alloying on the microstructure and service reliability of the Sn-9Zn-0.02Al/Cu solder joint: Combined experimental and theoretical study
Zhihang Zhang, Jinghao Xu, Zida Wang, et al.
Engineering Failure Analysis (2025), pp. 109429-109429
Closed Access
Zhihang Zhang, Jinghao Xu, Zida Wang, et al.
Engineering Failure Analysis (2025), pp. 109429-109429
Closed Access
Influence and mechanism of ultrafast laser-textured Cu substrate on wetting behavior of SAC305 solder
Tao Ma, Z.G. Zhang, Shiqiang Zhang, et al.
Optics & Laser Technology (2024) Vol. 182, pp. 112190-112190
Closed Access | Times Cited: 1
Tao Ma, Z.G. Zhang, Shiqiang Zhang, et al.
Optics & Laser Technology (2024) Vol. 182, pp. 112190-112190
Closed Access | Times Cited: 1
Influence behavior and mechanism of double-layer Gr stacking configuration on mechanical strength and thermoelectric transport properties of Cu/Gr composites
Zhihang Zhang, Baishan Liu, Xiaohui Zhang, et al.
Vacuum (2024) Vol. 230, pp. 113641-113641
Closed Access | Times Cited: 1
Zhihang Zhang, Baishan Liu, Xiaohui Zhang, et al.
Vacuum (2024) Vol. 230, pp. 113641-113641
Closed Access | Times Cited: 1
Design, preparation, and double-mechanism strengthening effect analysis of Sn-Zn-Al-Pt solder alloy with high service performance
Zhihang Zhang, Shiqiang Zhang, Tao Ma, et al.
Materials Science and Engineering A (2024), pp. 147755-147755
Closed Access | Times Cited: 1
Zhihang Zhang, Shiqiang Zhang, Tao Ma, et al.
Materials Science and Engineering A (2024), pp. 147755-147755
Closed Access | Times Cited: 1
