OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint
Muhammad Abdullah, Hing Wah Lee
Microelectronic Engineering (2024) Vol. 290, pp. 112189-112189
Closed Access | Times Cited: 6
Muhammad Abdullah, Hing Wah Lee
Microelectronic Engineering (2024) Vol. 290, pp. 112189-112189
Closed Access | Times Cited: 6
Showing 6 citing articles:
Phase transformation, microstructural evolution and mechanical degradation of SnAg2.4/Cu solder joints at 160 °C high-temperature storage test
Xinyi Jing, Weitong Sun, Liqiang Cao, et al.
Materials Characterization (2025) Vol. 221, pp. 114802-114802
Closed Access | Times Cited: 1
Xinyi Jing, Weitong Sun, Liqiang Cao, et al.
Materials Characterization (2025) Vol. 221, pp. 114802-114802
Closed Access | Times Cited: 1
Flexible Three-Dimensional Integrated Circuits (3D ICs) Based on Liquid Metal
Ruixue Tian, Jianhui Chen, Ming Zhu, et al.
Wearable electronics. (2025) Vol. 2, pp. 1-17
Open Access
Ruixue Tian, Jianhui Chen, Ming Zhu, et al.
Wearable electronics. (2025) Vol. 2, pp. 1-17
Open Access
Effect of diethylenetriamine pentaacetate pentasodium and guanidine phosphate on chemical mechanical polishing of TSV barrier layer
Xuhua Chen, Ru Wang, Zhanjie Du, et al.
Materials Science and Engineering B (2025) Vol. 314, pp. 117993-117993
Closed Access
Xuhua Chen, Ru Wang, Zhanjie Du, et al.
Materials Science and Engineering B (2025) Vol. 314, pp. 117993-117993
Closed Access
Effect of aminoguanidine hydrochloride on chemical mechanical polishing of Ta-based barrier layers on TSV wafers
Zhu Yu, Ru Wang, Xuhua Chen, et al.
Materials Science in Semiconductor Processing (2025) Vol. 196, pp. 109574-109574
Closed Access
Zhu Yu, Ru Wang, Xuhua Chen, et al.
Materials Science in Semiconductor Processing (2025) Vol. 196, pp. 109574-109574
Closed Access
Recent Applications of Focused Ion Beam–Scanning Electron Microscopy in Advanced Packaging
Huan Zhang, Mengmeng Ma, Yuhang Liu, et al.
Journal of Manufacturing and Materials Processing (2025) Vol. 9, Iss. 5, pp. 158-158
Open Access
Huan Zhang, Mengmeng Ma, Yuhang Liu, et al.
Journal of Manufacturing and Materials Processing (2025) Vol. 9, Iss. 5, pp. 158-158
Open Access
Study of the impact of flake Al2O3 abrasive and N-n-Butylimidazole in backside CMP (Chemical Mechanical Polishing) of TSV (Through Silicon Via) wafers
Zhanjie Du, Ru Wang, Xuhua Chen, et al.
Surfaces and Interfaces (2024), pp. 105626-105626
Closed Access | Times Cited: 3
Zhanjie Du, Ru Wang, Xuhua Chen, et al.
Surfaces and Interfaces (2024), pp. 105626-105626
Closed Access | Times Cited: 3
Electronic and mechanical properties of η-Cu6Sn5 doped by Ni: A first-principles study
Jianhua Sheng, Jian Zhao, Biao Wang, et al.
Materials Today Communications (2024) Vol. 40, pp. 110051-110051
Closed Access
Jianhua Sheng, Jian Zhao, Biao Wang, et al.
Materials Today Communications (2024) Vol. 40, pp. 110051-110051
Closed Access
