OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
A Green Conformable Thermoformed Printed Circuit Board Sourced from Renewable Materials
Amirsoheil Honarbari, Pietro Cataldi, Arkadiusz Żych, et al.
ACS Applied Electronic Materials (2023) Vol. 5, Iss. 9, pp. 5050-5060
Open Access | Times Cited: 11
Amirsoheil Honarbari, Pietro Cataldi, Arkadiusz Żych, et al.
ACS Applied Electronic Materials (2023) Vol. 5, Iss. 9, pp. 5050-5060
Open Access | Times Cited: 11
Showing 11 citing articles:
Eco-friendly alternatives to printed circuit boards: developing natural fiber polymer composites with optimized flammability and moisture resistance
T. Sathish, Jayant Giri, R. Saravanan, et al.
Journal of Materials Science Materials in Electronics (2025) Vol. 36, Iss. 6
Closed Access | Times Cited: 3
T. Sathish, Jayant Giri, R. Saravanan, et al.
Journal of Materials Science Materials in Electronics (2025) Vol. 36, Iss. 6
Closed Access | Times Cited: 3
Advancements in Biodegradable Printed Circuit Boards: Review of Material Properties, Fabrication Methods, Applications and Challenges
Chin Fhong Soon, See Khee Yee, Anis Nurashikin Nordin, et al.
International Journal of Precision Engineering and Manufacturing (2024) Vol. 25, Iss. 9, pp. 1925-1954
Closed Access | Times Cited: 13
Chin Fhong Soon, See Khee Yee, Anis Nurashikin Nordin, et al.
International Journal of Precision Engineering and Manufacturing (2024) Vol. 25, Iss. 9, pp. 1925-1954
Closed Access | Times Cited: 13
Sustainable printed circuit board substrates based on flame-retarded PLA/flax composites to reduce environmental load of electronics: Quality, reliability, degradation and application tests
Csaba Farkas, László Gál, András Csiszár, et al.
Sustainable materials and technologies (2024) Vol. 40, pp. e00902-e00902
Open Access | Times Cited: 9
Csaba Farkas, László Gál, András Csiszár, et al.
Sustainable materials and technologies (2024) Vol. 40, pp. e00902-e00902
Open Access | Times Cited: 9
Designing a filler material to reduce dielectric loss in epoxy-based substrates for high-frequency applications
Ilkan Calisir, Elliot L. Bennett, Xiantao Yang, et al.
RSC Advances (2025) Vol. 15, Iss. 2, pp. 754-763
Open Access
Ilkan Calisir, Elliot L. Bennett, Xiantao Yang, et al.
RSC Advances (2025) Vol. 15, Iss. 2, pp. 754-763
Open Access
Valorisation of exotic fruit residues: Sustainable green dielectric and insulating materials for energy and waste management solutions
Yuliana Pullas, María Fernanda Lecaro, Juan Fernando Posso, et al.
Green Technologies and Sustainability (2025), pp. 100193-100193
Open Access
Yuliana Pullas, María Fernanda Lecaro, Juan Fernando Posso, et al.
Green Technologies and Sustainability (2025), pp. 100193-100193
Open Access
Multilayer packaging recycling: challenges, current practices, and future prospects
Yenni Ciawi, Silvia Gabrina Tonyes, Ni Made Utami Dwipayanti
(2025) Vol. 2, Iss. 1
Open Access
Yenni Ciawi, Silvia Gabrina Tonyes, Ni Made Utami Dwipayanti
(2025) Vol. 2, Iss. 1
Open Access
An Introductory Overview of Various Typical Lead-Free Solders for TSV Technology
Sooyong Choi, Sooman Lim, Muhamad Mukhzani Muhamad Hanifah, et al.
Inorganics (2025) Vol. 13, Iss. 3, pp. 86-86
Open Access
Sooyong Choi, Sooman Lim, Muhamad Mukhzani Muhamad Hanifah, et al.
Inorganics (2025) Vol. 13, Iss. 3, pp. 86-86
Open Access
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering
Songtao Qu, Qingyu Shi, Gong Zhang, et al.
Soldering and Surface Mount Technology (2024)
Closed Access | Times Cited: 2
Songtao Qu, Qingyu Shi, Gong Zhang, et al.
Soldering and Surface Mount Technology (2024)
Closed Access | Times Cited: 2
Advanced Recovery Strategies for Metallic and Nonmetallic Fractions from Waste Printed Circuit Boards: A Comprehensive Review
Jie Zhang, Zhengxin Peng, Jiang Wang, et al.
Separation and Purification Reviews (2024), pp. 1-23
Closed Access | Times Cited: 1
Jie Zhang, Zhengxin Peng, Jiang Wang, et al.
Separation and Purification Reviews (2024), pp. 1-23
Closed Access | Times Cited: 1
Beyond Plastic: Oleogel as gel-state biodegradable thermoplastics
Leonardo Lamanna, Gabriele Corigliano, Athira Narayanan, et al.
Chemical Engineering Journal (2024) Vol. 498, pp. 154988-154988
Open Access | Times Cited: 1
Leonardo Lamanna, Gabriele Corigliano, Athira Narayanan, et al.
Chemical Engineering Journal (2024) Vol. 498, pp. 154988-154988
Open Access | Times Cited: 1
Removal of heavy metals and organic compounds from wastewater printing circuit board manufacturers via a hybrid ferrate(VI)-trithiocarbonate process: An optimization study and toxicity assessment
Maciej Thomas, Helena Hybská, Susan J. Masten, et al.
Chemical Engineering Journal (2024), pp. 158330-158330
Closed Access
Maciej Thomas, Helena Hybská, Susan J. Masten, et al.
Chemical Engineering Journal (2024), pp. 158330-158330
Closed Access
