OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications
Shanjun Ding, Zhidan Fang, Zhongyao Yu, et al.
ACS Omega (2023) Vol. 8, Iss. 36, pp. 32907-32916
Open Access | Times Cited: 12
Shanjun Ding, Zhidan Fang, Zhongyao Yu, et al.
ACS Omega (2023) Vol. 8, Iss. 36, pp. 32907-32916
Open Access | Times Cited: 12
Showing 12 citing articles:
Catalytic cyanate resin with polysulfide cation catalyst and its ultra‐high molecular weight polyethylene fiber composites for radome
Jingyu Jiang, Hongbo Geng, Ke Xu, et al.
Polymer Composites (2024) Vol. 45, Iss. 12, pp. 11241-11251
Closed Access | Times Cited: 4
Jingyu Jiang, Hongbo Geng, Ke Xu, et al.
Polymer Composites (2024) Vol. 45, Iss. 12, pp. 11241-11251
Closed Access | Times Cited: 4
Cellulose paper-based printed sensor for efficient cure process control in fiber reinforced epoxy composite
Mohammed Khalifa, Herfried Lammer, Mohammed Sohail Bakshi
Cellulose (2025)
Closed Access
Mohammed Khalifa, Herfried Lammer, Mohammed Sohail Bakshi
Cellulose (2025)
Closed Access
A study on cure kinetics and time-temperature-transformation cure diagram of epoxy/cyanate ester co-curing system
Yajing Qiao, An Xing, Chenchen Gao, et al.
Polymer (2025), pp. 128230-128230
Closed Access
Yajing Qiao, An Xing, Chenchen Gao, et al.
Polymer (2025), pp. 128230-128230
Closed Access
Novel heat‐resistant and tough cyanate ester resin matrix for carbon fiber composite via wet winding process molding at a reduced temperature
Yijia Zhou, Ke Xu, Hongbo Geng, et al.
Polymer Composites (2025)
Closed Access
Yijia Zhou, Ke Xu, Hongbo Geng, et al.
Polymer Composites (2025)
Closed Access
Research progress of interfacial adhesion force of copper plating on Ajinomoto build-up films for chip substrates
Shanjun Ding, Zhidan Fang, Zhongyao Yu, et al.
Materials Today Communications (2023) Vol. 37, pp. 107201-107201
Closed Access | Times Cited: 4
Shanjun Ding, Zhidan Fang, Zhongyao Yu, et al.
Materials Today Communications (2023) Vol. 37, pp. 107201-107201
Closed Access | Times Cited: 4
Heterointerfacial adhesion failure mechanism of ultrahigh filler loading containing epoxy composite films for chip substrates
Shanjun Ding, Xiao‐Meng Wu, Xu Zhang, et al.
RSC Applied Interfaces (2024)
Open Access | Times Cited: 1
Shanjun Ding, Xiao‐Meng Wu, Xu Zhang, et al.
RSC Applied Interfaces (2024)
Open Access | Times Cited: 1
Strong Adhesion of Electroless Plated Copper by Optimizing Lamination Temperature of Epoxy Composite Film for Advanced Chip Packaging Substrates
Suibin Luo, Junyi Yu, Peilin Ma, et al.
Advanced Engineering Materials (2024) Vol. 26, Iss. 16
Closed Access | Times Cited: 1
Suibin Luo, Junyi Yu, Peilin Ma, et al.
Advanced Engineering Materials (2024) Vol. 26, Iss. 16
Closed Access | Times Cited: 1
Polymer-Based Electronic Packaging Molding Compounds, Specifically Thermal Performance Improvement: An Overview
Xiaohan Li, Jiateng Huang, Ya‐Wen Chen, et al.
ACS Applied Polymer Materials (2024)
Closed Access | Times Cited: 1
Xiaohan Li, Jiateng Huang, Ya‐Wen Chen, et al.
ACS Applied Polymer Materials (2024)
Closed Access | Times Cited: 1
A Study of Hydroxyl-Terminated Block Copolyether-Based Binder Curing Kinetics
Wu Yang, Zhengmao Ding, Cong Zhu, et al.
Polymers (2024) Vol. 16, Iss. 16, pp. 2246-2246
Open Access
Wu Yang, Zhengmao Ding, Cong Zhu, et al.
Polymers (2024) Vol. 16, Iss. 16, pp. 2246-2246
Open Access
Curing kinetics of block copolymerization thermoset polyurethane by non‐isothermal DSC method
Tianqi Li, Junjie Xu, Mengjing An, et al.
Journal of Applied Polymer Science (2024)
Closed Access
Tianqi Li, Junjie Xu, Mengjing An, et al.
Journal of Applied Polymer Science (2024)
Closed Access
Curing kinetics and thermal stability enhancement of epoxy system via co-curing with octapolyether (amine)- terminated POSS
Zeinab Farhadinejad, Majid Karimi, Morteza Ehsani
Research Square (Research Square) (2024)
Open Access
Zeinab Farhadinejad, Majid Karimi, Morteza Ehsani
Research Square (Research Square) (2024)
Open Access
Enhanced adhesion strength of copper deposited epoxy composite films for chip substrates by tuning copper oxide and internal stress
Shanjun Ding, Xiao‐Meng Wu, Chuan Chen, et al.
Applied Surface Science (2024), pp. 161911-161911
Closed Access
Shanjun Ding, Xiao‐Meng Wu, Chuan Chen, et al.
Applied Surface Science (2024), pp. 161911-161911
Closed Access
