OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

3-D Numerical Multiphysics Model for Cu-Al Wire Bond Corrosion
Pradeep Lall, Yunli Zhang, Jeff Suhling, et al.
(2019)
Closed Access | Times Cited: 14

Showing 14 citing articles:

Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire
Qi Li, Yangbo Li, Haodong Fu, et al.
IEEE Transactions on Components Packaging and Manufacturing Technology (2023) Vol. 13, Iss. 7, pp. 1045-1057
Closed Access | Times Cited: 14

The Degradation Mechanisms of Underfills Subjected to High Temperature Long Term Aging
Pradeep Lall, Yunli Zhang, Jeffrey C. Suhling, et al.
(2020)
Closed Access | Times Cited: 10

Degradation Mechanisms of Epoxy Molding Compound Subjected to High Temperature Long Term Aging
Pradeep Lall, Yunli Zhang, Jaimal Williamson
(2021), pp. 610-616
Closed Access | Times Cited: 8

Reduced Relative Humidity (RH) Enhances the Corrosion-Limited Lifetime of Self-Heated IC: Peck’s equation Generalized
M. Asaduz Zaman Mamun, Muhammad A. Alam
2022 IEEE International Reliability Physics Symposium (IRPS) (2022), pp. 8A.5-8
Closed Access | Times Cited: 4

Characterization of Viscoelastic Behavior of Epoxy Molding Compounds Subjected to Sustained High Temperature Environment up to 1 year
Pradeep Lall, Yunli Zhang, Jeff Suhling
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (2022), pp. 1-8
Closed Access | Times Cited: 4

Damage Progression in Electronic Molding Compounds under Sustained High Temperature for up to 1-year in Automotive Underhood Environments
Pradeep Lall, Yunli Zhang
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (2022), pp. 1-8
Closed Access | Times Cited: 4

A Universal Scaling Formulation of the Generalized Peck’s Equation for Corrosion Limited Lifetime in Self-Heated ICs
M. Asaduz Zaman Mamun, Muhammad A. Alam
IEEE Transactions on Components Packaging and Manufacturing Technology (2023) Vol. 13, Iss. 6, pp. 888-896
Closed Access | Times Cited: 2

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry
Maria Abu Bakar, A. Atiqah, Azman Jalar
Sustainability (2022) Vol. 14, Iss. 23, pp. 15730-15730
Open Access | Times Cited: 3

Thermal Stability and Viscoelasticity Behavior of Underfill Encapsulants in Sustained High Temperature Environment up to 1-year
Pradeep Lall, Yunli Zhang, Jeff Suhling
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (2022), pp. 1-8
Closed Access | Times Cited: 3

Transient Leakage Current as a Non-destructive Probe of Wire-bond Electrochemical Failures
M. Asaduz Zaman Mamun, A. Mavinkurve, M. van Soestbergen, et al.
2022 IEEE International Reliability Physics Symposium (IRPS) (2023), pp. 1-7
Closed Access | Times Cited: 1

Reliability Performance Analysis of Magnetically-Oriented ACA for Flexible and Stretchable Electronics
Pradeep Lall, Yunli Zhang, Scott Miller
(2024), pp. 1-8
Closed Access

Post wirebonding coating for prevention of corrosion of wire bonded packages by chlorine containing foreign particles
Varughese Mathew, Sheila Chopin, Guangming Li, et al.
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
Closed Access | Times Cited: 1

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