OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Effect of Conventional and Granular Capillaries Usage on the Bondability, Reliability, and Manufacturability of Gold Wedge Bonds
Muhammad Nubli Zulkifli, Azman Jalar, Fuaida Harun
IEEE Transactions on Components Packaging and Manufacturing Technology (2019) Vol. 9, Iss. 4, pp. 763-769
Closed Access | Times Cited: 4
Muhammad Nubli Zulkifli, Azman Jalar, Fuaida Harun
IEEE Transactions on Components Packaging and Manufacturing Technology (2019) Vol. 9, Iss. 4, pp. 763-769
Closed Access | Times Cited: 4
Showing 4 citing articles:
Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages
Khirullah Abdul Hamid, Aiman Hakim Badarisman, Azman Jalar, et al.
Journal of Physics Conference Series (2022) Vol. 2169, Iss. 1, pp. 012016-012016
Open Access | Times Cited: 8
Khirullah Abdul Hamid, Aiman Hakim Badarisman, Azman Jalar, et al.
Journal of Physics Conference Series (2022) Vol. 2169, Iss. 1, pp. 012016-012016
Open Access | Times Cited: 8
2019 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 9
IEEE Transactions on Components Packaging and Manufacturing Technology (2019) Vol. 9, Iss. 12, pp. 2514-2572
Open Access
IEEE Transactions on Components Packaging and Manufacturing Technology (2019) Vol. 9, Iss. 12, pp. 2514-2572
Open Access
EVOLUTION OF DISCRETE SEMICONDUCTOR COPPER WEDGE BOND IN BIASED TEMPERATURE HUMIDITY CHAMBER
Abdul Aziz Omar, Azman Jalar, Khirullah Abdul Hamid
Jurnal Teknologi (2022) Vol. 84, Iss. 6-2, pp. 127-133
Open Access
Abdul Aziz Omar, Azman Jalar, Khirullah Abdul Hamid
Jurnal Teknologi (2022) Vol. 84, Iss. 6-2, pp. 127-133
Open Access
Elucidation of Metal Etching Defects Through the Experimental Design Process Characterization at Encapsulation and Electro-deflashing Processes
Nadia Nor Ahmad Taufiq, Khirullah bin Abdul Hamid, Aiman Hakim Badarisman, et al.
(2021), pp. 69-72
Closed Access
Nadia Nor Ahmad Taufiq, Khirullah bin Abdul Hamid, Aiman Hakim Badarisman, et al.
(2021), pp. 69-72
Closed Access
