OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Research of Vertical via Based on Silicon, Ceramic and Glass
Wenchao Tian, Sixian Wu, Wenhua Li
Micromachines (2023) Vol. 14, Iss. 7, pp. 1391-1391
Open Access | Times Cited: 10
Wenchao Tian, Sixian Wu, Wenhua Li
Micromachines (2023) Vol. 14, Iss. 7, pp. 1391-1391
Open Access | Times Cited: 10
Showing 10 citing articles:
Effect of diethylenetriamine pentaacetate pentasodium and guanidine phosphate on chemical mechanical polishing of TSV barrier layer
Xuhua Chen, Ru Wang, Zhanjie Du, et al.
Materials Science and Engineering B (2025) Vol. 314, pp. 117993-117993
Closed Access
Xuhua Chen, Ru Wang, Zhanjie Du, et al.
Materials Science and Engineering B (2025) Vol. 314, pp. 117993-117993
Closed Access
Fabrication of ultra-thin glass sheets and their application to MEMS devices
Yo Tanaka
Analytical Sciences (2025)
Open Access
Yo Tanaka
Analytical Sciences (2025)
Open Access
Research Status of Copper Film Slurries for Through-Silicon Via Process
Xuhua Chen, Zeyu Liu, Ru Wang, et al.
Journal of Electronic Materials (2024)
Closed Access | Times Cited: 2
Xuhua Chen, Zeyu Liu, Ru Wang, et al.
Journal of Electronic Materials (2024)
Closed Access | Times Cited: 2
Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging
Wenchao Tian, Dexin Li, H. Dang, et al.
Micromachines (2024) Vol. 15, Iss. 9, pp. 1087-1087
Open Access | Times Cited: 2
Wenchao Tian, Dexin Li, H. Dang, et al.
Micromachines (2024) Vol. 15, Iss. 9, pp. 1087-1087
Open Access | Times Cited: 2
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure
Tingwei Gu, Ning Liu, Z. C. Feng, et al.
Microelectronics Reliability (2024) Vol. 163, pp. 115545-115545
Closed Access | Times Cited: 1
Tingwei Gu, Ning Liu, Z. C. Feng, et al.
Microelectronics Reliability (2024) Vol. 163, pp. 115545-115545
Closed Access | Times Cited: 1
Effect of 2-Mercapto-1-methylimidazole on the Dual Action of Chemical Mechanical Polishing of Cu and Ta
Xuhua Chen, Ru Wang, Zhanjie Du, et al.
Langmuir (2024)
Closed Access | Times Cited: 1
Xuhua Chen, Ru Wang, Zhanjie Du, et al.
Langmuir (2024)
Closed Access | Times Cited: 1
Research on Crystal Structure Evolution and Failure Mechanism during TSV-Metal Line Electromigration Process
Tao Gong, Liangliang Xie, Si Chen, et al.
Crystals (2023) Vol. 14, Iss. 1, pp. 37-37
Open Access | Times Cited: 3
Tao Gong, Liangliang Xie, Si Chen, et al.
Crystals (2023) Vol. 14, Iss. 1, pp. 37-37
Open Access | Times Cited: 3
Study on Cavitation, Warpage Deformation, and Moisture Diffusion of Sop-8 Devices during Molding Process
Wenchao Tian, Shuaiqi Zhang, Wenbin Li, et al.
Micromachines (2023) Vol. 14, Iss. 12, pp. 2175-2175
Open Access | Times Cited: 2
Wenchao Tian, Shuaiqi Zhang, Wenbin Li, et al.
Micromachines (2023) Vol. 14, Iss. 12, pp. 2175-2175
Open Access | Times Cited: 2
Progress in Research on Co-Packaged Optics
Wenchao Tian, Huahua Hou, H. Dang, et al.
Micromachines (2024) Vol. 15, Iss. 10, pp. 1211-1211
Open Access
Wenchao Tian, Huahua Hou, H. Dang, et al.
Micromachines (2024) Vol. 15, Iss. 10, pp. 1211-1211
Open Access
Signal integrity and heat transfer performance of through-boron nitride via
Chao Sun, Chunmin Cheng, Zhaofu Zhang, et al.
Microelectronics Reliability (2024) Vol. 163, pp. 115531-115531
Closed Access
Chao Sun, Chunmin Cheng, Zhaofu Zhang, et al.
Microelectronics Reliability (2024) Vol. 163, pp. 115531-115531
Closed Access
