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OpenAlex Citation Counts

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OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!

If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.

Requested Article:

Copper Wire Bonding: A Review
Hongliang Zhou, Andong Chang, Junling Fan, et al.
Micromachines (2023) Vol. 14, Iss. 8, pp. 1612-1612
Open Access | Times Cited: 13

Showing 13 citing articles:

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
Wei Chen, Xu Liu, Dong Hu, et al.
Materials & Design (2024) Vol. 238, pp. 112702-112702
Open Access | Times Cited: 5
Exploring the evolution of texture and properties of ultrafine copper wire during high strain drawing process
Jinsong Liu, Yan Zhou, Songwei Wang, et al.
Journal of Central South University (2025)
Closed Access
Interface energy, adhesion work and electronic structure of Al/PdCu interface calculated from first principles
Hui Xiong, Sineng Yang, Kun Zhu, et al.
Materials Today Communications (2025), pp. 112385-112385
Closed Access
Soldering and Bonding in Contemporary Electronic Device Packaging
Yuxuan Li, Bei Pan, Zhenting Ge, et al.
Materials (2025) Vol. 18, Iss. 9, pp. 2015-2015
Open Access
Molecular dynamics simulation study of Zr interposer promoting Cu-Cu low-temperature hybrid bonding
Wentao Ni, Rui Li, Zhiqiang Tian, et al.
Materials Today Communications (2024) Vol. 40, pp. 109828-109828
Closed Access | Times Cited: 3
Research on Shape-Controllable Localized Heating Method Driven by Digital Microfluidics
Shangru Zhou, Hui Wang, Gaofeng Zhang, et al.
Langmuir (2024) Vol. 40, Iss. 46, pp. 24731-24739
Closed Access | Times Cited: 1
A Review of Silver Wire Bonding Techniques
Bin An, Hongliang Zhou, Jun Cao, et al.
Micromachines (2023) Vol. 14, Iss. 11, pp. 2129-2129
Open Access | Times Cited: 2
Ultrasonic Bonding of Ag Ribbon on Si Wafers With Various Backside Metallization
Meng-Ting Chiang, Pei‐Ing Lee, Ang-Ying Lin, et al.
International Journal of Manufacturing Materials and Mechanical Engineering (2023) Vol. 13, Iss. 1, pp. 1-11
Open Access | Times Cited: 1
Enhancing microscale additive manufacturing: Electrolyte-column localized electrochemical deposition for microwire and microdevice substrate connection
Ge Qin, Lei Han, Shiwei Li, et al.
International Journal of Electrochemical Science (2024) Vol. 19, Iss. 8, pp. 100683-100683
Open Access
A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface
Junling Fan, Donglin Yuan, Juan Du, et al.
Materials (2024) Vol. 17, Iss. 17, pp. 4335-4335
Open Access
Tensile strength of specimens manufactured using laser wire bonding
Laura Budde, Marvin Spengler, Nick Schwarz, et al.
Journal of Laser Applications (2024) Vol. 36, Iss. 4
Closed Access
Simulation study on the effect of palladium layer thickness and temperature on the bonding properties of palladium coated copper wire
Bin An, Hongliang Zhou, Jun Cao, et al.
Microelectronics Reliability (2024) Vol. 162, pp. 115515-115515
Closed Access
Experimental study on spheroidal morphology of palladium coated copper wire with different palladium layer thickness
Bin An, Hongliang Zhou, Jun Cao, et al.
APL Materials (2024) Vol. 12, Iss. 10
Open Access
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