OpenAlex is a bibliographic catalogue of scientific papers, authors and institutions accessible in open access mode, named after the Library of Alexandria. It's citation coverage is excellent and I hope you will find utility in this listing of citing articles!
If you click the article title, you'll navigate to the article, as listed in CrossRef. If you click the Open Access links, you'll navigate to the "best Open Access location". Clicking the citation count will open this listing for that article. Lastly at the bottom of the page, you'll find basic pagination options.
Requested Article:
Thin Film Encapsulation for RF MEMS in 5G and Modern Telecommunication Systems
Anna Persano, F. Quaranta, A. Taurino, et al.
Sensors (2020) Vol. 20, Iss. 7, pp. 2133-2133
Open Access | Times Cited: 16
Anna Persano, F. Quaranta, A. Taurino, et al.
Sensors (2020) Vol. 20, Iss. 7, pp. 2133-2133
Open Access | Times Cited: 16
Showing 16 citing articles:
An analysis of micro deep drawing of ferritic stainless steel 430 using crystal plasticity finite element method
Jingwei Zhao, Zhengyi Jiang, Zhihua Wang, et al.
Journal of Materials Research and Technology (2022) Vol. 20, pp. 2247-2261
Open Access | Times Cited: 18
Jingwei Zhao, Zhengyi Jiang, Zhihua Wang, et al.
Journal of Materials Research and Technology (2022) Vol. 20, pp. 2247-2261
Open Access | Times Cited: 18
Influence of blank holder-die gap on micro-deep drawing of SUS304 cups
Liang Luo, Dongbin Wei, Guoqing Zu, et al.
International Journal of Mechanical Sciences (2020) Vol. 191, pp. 106065-106065
Closed Access | Times Cited: 26
Liang Luo, Dongbin Wei, Guoqing Zu, et al.
International Journal of Mechanical Sciences (2020) Vol. 191, pp. 106065-106065
Closed Access | Times Cited: 26
Anisotropic plasticity deformation during micro-deep drawing of 304 foils: An experimental and numerical investigation
Lei Shang, Suxia Huang, Jianhua Hu, et al.
International Journal of Material Forming (2024) Vol. 17, Iss. 3
Closed Access | Times Cited: 3
Lei Shang, Suxia Huang, Jianhua Hu, et al.
International Journal of Material Forming (2024) Vol. 17, Iss. 3
Closed Access | Times Cited: 3
An All-Silicon Process Platform for Wafer-Level Vacuum Packaged MEMS Devices
Mustafa Mert Torunbalcı, H. D. Gavcar, Ferhat Yesil, et al.
IEEE Sensors Journal (2021) Vol. 21, Iss. 13, pp. 13958-13964
Closed Access | Times Cited: 17
Mustafa Mert Torunbalcı, H. D. Gavcar, Ferhat Yesil, et al.
IEEE Sensors Journal (2021) Vol. 21, Iss. 13, pp. 13958-13964
Closed Access | Times Cited: 17
A comprehensive overview of recent developments in RF-MEMS technology-based high-performance passive components for applications in the 5G and future telecommunications scenarios
Girolamo Tagliapietra, Jacopo Iannacci
Facta universitatis - series Electronics and Energetics (2021) Vol. 34, Iss. 3, pp. 333-366
Open Access | Times Cited: 11
Girolamo Tagliapietra, Jacopo Iannacci
Facta universitatis - series Electronics and Energetics (2021) Vol. 34, Iss. 3, pp. 333-366
Open Access | Times Cited: 11
Experimental investigation of the multi-stage micro-deep drawing of pure titanium foils with different grain sizes
Peisheng Han, YuLin Xing, Guofeng Yuan, et al.
Journal of Materials Science (2022) Vol. 57, Iss. 31, pp. 15094-15108
Closed Access | Times Cited: 7
Peisheng Han, YuLin Xing, Guofeng Yuan, et al.
Journal of Materials Science (2022) Vol. 57, Iss. 31, pp. 15094-15108
Closed Access | Times Cited: 7
RF-MEMS capacitive switches: enabling transition towards 5G/B5G applications
Raj Kumari, Mahesh Angira
International Journal of Information Technology (2023) Vol. 15, Iss. 7, pp. 3889-3897
Closed Access | Times Cited: 4
Raj Kumari, Mahesh Angira
International Journal of Information Technology (2023) Vol. 15, Iss. 7, pp. 3889-3897
Closed Access | Times Cited: 4
Material-dependent thermoelastic damping limited quality factor and critical length analysis with size effects of micro/nanobeams
R. Resmi, V. Suresh Babu, M. R. Baiju
Journal of Mechanical Science and Technology (2022) Vol. 36, Iss. 6, pp. 3017-3038
Closed Access | Times Cited: 4
R. Resmi, V. Suresh Babu, M. R. Baiju
Journal of Mechanical Science and Technology (2022) Vol. 36, Iss. 6, pp. 3017-3038
Closed Access | Times Cited: 4
Thermoelastic Damping Limited Quality Factor Enhancement and Energy Dissipation Analysis of Rectangular Plate Resonators Using Nonclassical Elasticity Theory
R. Resmi, V. Suresh Babu, M. R. Baiju
Advances in Materials Science and Engineering (2022) Vol. 2022, pp. 1-19
Open Access | Times Cited: 3
R. Resmi, V. Suresh Babu, M. R. Baiju
Advances in Materials Science and Engineering (2022) Vol. 2022, pp. 1-19
Open Access | Times Cited: 3
Low-Temperature Thin Film Encapsulation for MEMS With Silicon Nitride/Chromium Cap
Anna Persano, Alvise Bagolini, Jacopo Iannacci, et al.
IEEE Sensors Journal (2023) Vol. 23, Iss. 15, pp. 16710-16720
Open Access | Times Cited: 1
Anna Persano, Alvise Bagolini, Jacopo Iannacci, et al.
IEEE Sensors Journal (2023) Vol. 23, Iss. 15, pp. 16710-16720
Open Access | Times Cited: 1
Experimental Study on Multi-pass Micro-deep Drawing Forming of Pure Titanium Foil with Different Punch Radii
Jianjun Hao, Z. Cheng, Peisheng Han
Journal of Materials Engineering and Performance (2024)
Closed Access
Jianjun Hao, Z. Cheng, Peisheng Han
Journal of Materials Engineering and Performance (2024)
Closed Access
Interfacial adhesion assessment of SiN/GaAs film/substrate system using microcantilever bending technique
Weikang Lin, Yitian Zhao, Feng Wang, et al.
Journal of Physics D Applied Physics (2022) Vol. 55, Iss. 24, pp. 245104-245104
Closed Access | Times Cited: 2
Weikang Lin, Yitian Zhao, Feng Wang, et al.
Journal of Physics D Applied Physics (2022) Vol. 55, Iss. 24, pp. 245104-245104
Closed Access | Times Cited: 2
Effects of annealing temperature on micro deep drawing of stainless steel-copper composite
Yanyang Qi, X G, Lourival Marin Mendes, et al.
IOP Conference Series Materials Science and Engineering (2022) Vol. 1270, Iss. 1, pp. 012092-012092
Open Access | Times Cited: 1
Yanyang Qi, X G, Lourival Marin Mendes, et al.
IOP Conference Series Materials Science and Engineering (2022) Vol. 1270, Iss. 1, pp. 012092-012092
Open Access | Times Cited: 1
Adhesion Evaluation of an Embedded SiN/GaAs Interface Using a Novel “Push-Out” Technique
Sahar Dehkhoda, Mingyuan Lu, Han Huang
Micromachines (2022) Vol. 14, Iss. 1, pp. 37-37
Open Access | Times Cited: 1
Sahar Dehkhoda, Mingyuan Lu, Han Huang
Micromachines (2022) Vol. 14, Iss. 1, pp. 37-37
Open Access | Times Cited: 1
5G and its impact on environment, biodiversity and human health: An overview
Sadguru Prakash, Alok Kumar Shukla
International Journal of Applied Research (2021) Vol. 7, Iss. 5, pp. 100-104
Open Access | Times Cited: 1
Sadguru Prakash, Alok Kumar Shukla
International Journal of Applied Research (2021) Vol. 7, Iss. 5, pp. 100-104
Open Access | Times Cited: 1
Protective Packaging and Sealing Materials for 5G Mobile Devices
Colin Tong
Springer series in materials science (2022), pp. 217-230
Closed Access
Colin Tong
Springer series in materials science (2022), pp. 217-230
Closed Access
